K521F12ACD-B060 Overview
2009 K521F12ACD-B060 Preliminary MCP Specification 1Gb (128M x8) NAND Flash + 512Mb (32M x16) Mobile DDR SDRAM .DataSheet.co.kr datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
K521F12ACD-B060 Key Features
- Operating Temperature : -25°C ~ 85°C
- Package : 107ball FBGA Type
- 10.5x13x1.2mmt, 0.8mm pitch <NAND Flash>
- Voltage Supply : 1.7V ~ 1.95V
- Organization
- Memory Cell Array : (128M + 4M) x 8bit for 1Gb
- Data Register : (2K + 64) x 8bit
- Automatic Program and Erase
- Page Program : (2K + 64)Byte
- Block Erase : (128K + 4K)Byte