KLM8G1WEMB-B031
Description
SAMSUNG e - MMC is an embedded MMC solution designed in a BGA package form.
Key Features
- of the Samsung NAND flash and achieves optimal performance. 1.0 PRODUCT LIST [Table 1] Product List Capacities e
- Interface power : VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) - Memory power : VDDF (2.7V ~ 3.6V) Package size 11.5mm x 13mm x 0.8mm
