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KLMAG4FE4B-B001 Datasheet

Manufacturer: Samsung Semiconductor
KLMAG4FE4B-B001 datasheet preview

Datasheet Details

Part number KLMAG4FE4B-B001
Datasheet KLMAG4FE4B-B001-Samsung.pdf
File Size 834.96 KB
Manufacturer Samsung Semiconductor
Description embedded MMC
KLMAG4FE4B-B001 page 2 KLMAG4FE4B-B001 page 3

KLMAG4FE4B-B001 Overview

SAMSUNG CONFIDENTIAL Rev. 2012 KLMxGxFE4B-B001 Samsung e·MMC Product family e.MMC 4.5 Specification patibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only.

KLMAG4FE4B-B001 Key Features

  • DATA_TAG_SUPPORT is changed from 0x00 to 0x01
  • INI_TIMEOUT_AP is changed from 0x0A to 0x1E
  • TRIM_MULT is changed from 0x01 to 0x02
  • SEC_ERASE_MULT is changed from 0x0A to 0x1B
  • SEC_TRIM_MULT is changed from 0x0A to 0x11
  • ACC_SIZE is changed from 0x05 to 0x07
  • OUT_OF_INTERRUPT_TIME is changed from 0x01 to 0x02 6. Time Parameters are changed in Table 60
  • Initialization time is divided into ’Normal’ and ’After partition setting’
  • Write timeout is changed from 300ms to 350ms
  • Erase timeout is changed from 10ms to 15ms
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