KMN9W000RM-B205
Description
The KMN9W000RM is a Multi Chip Package Memory which bines 2GB e - MMC and 2Gbit LPDDR2 S4 SDRAM. The SAMSUNG e - MMC is an embedded MMC solution designed in a BGA package form.
Key Features
- Operating Temperature : -25C ~ 85C
- Package : 162ball FBGA Type
- 11.5 x 13 x 1.0mmt, 0.5mm pitch <e
- embedded MultiMediaCard System Specification Ver. 4.41 compatible. Detail description is referenced by JEDEC Standard
- MMC supports below special features which are defined in JEDEC
- High Priority Interrupt scheme is supported
- Background operation is supported
- Full backward patibility with previous MultiMediaCard system specification (1bit data bus, multi-e
- MMC systems)
- Data bus sidth :1bit(Default), 4bit and 8bit
