DSR1A
Features
:
- Glass passivated device
- Ideal for surface mouted applications
- Low reverse leakage
- Metallurgically bonded construction
- High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs.
(2.3kg) tension
- This is a Pb
- Free Device
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request
Mechanical Data:
- Case: JEDEC SOD-123SL molded plastic body over passivated chip
- Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
- Weight:0.0007 ounce, 0.02 grams
Mechanical Dimensions: In mm
SOD-123SL
- Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907
- - FAX (86) 25-87123900
- World Wide Web Site
- http://.sangdest..cn
- E-Mail Address
- sales@ sangdest..cn
- SANGDEST MICROELECTRONICS
Technical Data Data Sheet N1650, Rev.
- Marking Diagram:
Cautions：Molding resin Epoxy resin...
