GBPC15005 Overview
Key Specifications
Package: Module
Mount Type: Through Hole
Pins: 4
Height: 11.23 mm
Key Features
- Universal 3-way terminals: snap-on, wire wrap-around, or P.C.B. mounting
- Typical IR less than 0.3 μA
- High surge current capability
- Low - Solder Dip 260 °C, 40 seconds
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
