SF45G Overview
Key Features
- Super fast switching for high efficiency
- Low leakage current
- High forward surge capability
- Solder dip 260 °C, 40 s
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
- This is a Pb
- All SMC parts are traceable to the wafer lot
- Additional testing can be offered upon request Circuit Diagram Mechanical Data
- Case: JEDEC DO-201AD molded plastic body
- Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
