Datasheet4U Logo Datasheet4U.com

MFC110A - Thyristor/Diode Module

This page provides the datasheet information for the MFC110A, a member of the MFC90A Thyristor/Diode Module family.

Datasheet Summary

Description

The MTC, MFC module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

Features

  • High voltage.
  • Industrial standard package.
  • Low thermal resistance.
  • Designed and qualified for industrial level.
  • Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate.
  • High surge capability.
  • Easy mounting on heatsink MTC90A/110A MFC90A/110A.

📥 Download Datasheet

Datasheet preview – MFC110A

Datasheet Details

Part number MFC110A
Manufacturer Santry
File Size 234.25 KB
Description Thyristor/Diode Module
Datasheet download datasheet MFC110A Datasheet
Additional preview pages of the MFC110A datasheet.

📁 Similar Datasheet

  • MFC110 - Thyristor/Diode (TECHSEM)
  • MFC1000 - Device Set (Conexant Systems)
  • MFC - DC/DC Converter MFC Series (Interpoint Corporation)
  • MFC-4800 - Manual (brother)
  • MFC2000 - High Performance Bi-Directional Digital MEMS Gas Flow Sensor (MEMSIC)
  • MFC2000 - MultiFunctional Peripheral Controller (Conexant Systems)
  • MFC2030 - High Performance Bi-Directional Digital MEMS Gas Flow Sensor (MEMSIC)
  • MFC6040 - SIlicon Monolithic Functional-IC (ETC)
  • MFC6170-5 - VOLTAGE CONTROLLED OSCILLATOR (SYNERGY MICROWAVE CORPORATION)
  • MFC8020A - (MFC8020A / MFC8021A / MFC8022A) Audio Drivers (Freescale Semiconductor)
Other Datasheets by Santry
  • MFC90A - Thyristor/Diode Module

Full PDF Text Transcription

Click to expand full text
Thyristor/Thyristor Module Thyristor/Diode Module MECHANICAL DESCRIPTION The MTC, MFC module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
Published: |