Adoption of MBIT process. Package Dimensions
unit:mm 2039D
[2SC5302]
3.4 16.0
5.0 8.0
5.6 3.1
21.0
22.0
4.0
2.8 2.0
20.4
2.0
1.0
0.6
1
2
3
3.5
Specifications
Absolute Maximum Ratings at Ta = 25˚C
Pl arameter CV ollector-to-Base Voltage CV ollector-to-Emitter Voltage EV mitter-to-Base Voltage CI ollector Current CI ollector Current (pulse) CP ollector D.
The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
Ordering number:EN5363B
NPN Triple Diffused Planar Silicon Transistor
2SC5302
Ultrahigh-Definition CRT Display Horizontal Deflection Output Applications
Features
· Fast speed (t f=100ns typ). · High breakdown voltage (VCBO=1500V). · High reliability (adoption of HVP process). · Adoption of MBIT process.
Package Dimensions
unit:mm 2039D
[2SC5302]
3.4 16.0
5.0 8.0
5.6 3.1
21.0
22.0
4.0
2.8 2.0
20.4
2.0
1.0
0.6
1
2
3
3.5
Specifications
Absolute Maximum Ratings at Ta = 25˚C
Pl arameter CV ollector-to-Base Voltage CV ollector-to-Emitter Voltage EV mitter-to-Base Voltage CI ollector Current CI ollector Current (pulse) CP ollector Dissipation Jj unction Temperature Sg torage Temperature Ss ymbo CBO CEO EBO C CP C
Tc=25˚C
5.45
5.