B775 Overview
Key Specifications
Key Features
- Wide ASO because of on-chip ballast resistance
- Capable of being mounted easily becasuse of one- point fixing type plastic molded package (Interchangeable with TO-3)
- Large current capacity : IC=6A
- Highly resistance breakdown due to wide ASO. Package Dimensions unit:mm 2022A [2SB775/2SD895] ( ) : 2SB775 Specifications
