BZX84C3V9
Key Features
- Planar Die Construction
- 300 mW Power Dissipation on FR-5 PCB
- General Purpose, Medium Current
- Ideally Suited for Automated Assembly Process
- Zener Voltages from 2.4V - 39V
- Ultra-Small Surface Mount Package Power Dissipation MECHANICAL DATA
- Case: SOT-23, Molded Plastic
- Terminals: Solderable per MIL-STD-202, Method 208
- Polarity: See Diagrams
- Weight: 0.008 g (Approximately)
