BZX84C4V7 Datasheet (PDF) Download
SeCoS Halbleitertechnologie GmbH
BZX84C4V7

Key Features

  • Planar Die Construction
  • 300 mW Power Dissipation on FR-5 PCB
  • General Purpose, Medium Current
  • Ideally Suited for Automated Assembly Process
  • Zener Voltages from 2.4V – 39V
  • Ultra-Small Surface Mount Package Power Dissipation
  • Case: SOT-23, Molded Plastic
  • Terminals: Solderable per MIL-STD-202
  • Polarity: See Diagrams
  • Weight: 0.008 g (Approximately)