HBS808H
Key Features
- Surface mount bridge, small package
- Ideal for printed circuit boards
- Glass passivated chip junction
- High forward current capability up to 8A
- High surge current capability
- High heat dissipation capability
- Low profile package
- Low forward voltage drop
- Plastic package has Underwrites Laboratory Flammability Classification 94V-0 MECHANICAL DATA
- Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102
