MB08M Datasheet PDF

FEATURES

Halogen-free type Glass passivated chip junctions Compliance to RoHS product Leadless chip form, no lead damage Low power loss, High efficiency High current capability Plastic package has Underwriters Laboratory Flammability Classification 94V-0 APPLICATION AC/DC Power Supply Communication Equipment Lighting

MECHANICAL DATA

Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026 MARKING M PACKAGE INFORMATION Package MPQ MBCN 5K Leader Size 13 inch MBCN REF. A B C Millimeter Min. Max. 3.40 3.60 3.70 3.90 2.44 2.64 REF. D E F Millimeter Min. Max. 2.00 2.35 0.60 0.80 0.95 1.35

ABSOLUTE MAXIMUM RATINGS

( TA=25℃unless otherwise specified) Parameters Symbol Repetitive peak reverse voltage Average Forward Current on glass-epoxy P.C.B. 1 on aluminum substrate 2 Peak forward surge current, 8.3ms single half sine-wave Operating and Storage temperature range VRRM IF(AV) IFSM TJ, TSTG Rating 1000 0.5 0.8 30 -55 ~ 150 Unit V A A ℃

ELECTRICAL CHARACTERISTICS

(at TA=25℃unless otherwise specified) Parameters Symbol Min.