MB107
Key Features
- z High current capability
- Internal structure with GPRC (Glass Passivated Rectifier Chip) inside
- Leadless chip form, no lead damage
- Solder Joint, No Wire bond & Lead Frame
- Low profile package
- For surface mounted applications
- Built-in strain relief
- Low power loss, high efficiency
- High current capability and surge capacity
- Plastic package has UL Flammability Classification 94V-0 MECHANICAL DATA
