MMBZ5227BW
Overview
- Planar die construction
- 200mW power dissipation on FR-4 PCB
- General purpose, medium current
- Ideally suited for automated assembly
- SOT-323 A L 3 Top View CB 12 KE 1
- F GH 3 2 J REF. A B C
- E Millimeter Min. Max.
- 00 2.15 1.15
- 20 2.45 1.35
- 90 1.10
