Download MMBZ5239B Datasheet PDF
SeCoS Halbleitertechnologie GmbH
MMBZ5239B
FEATURES Planar Die Construction 300 m W Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Process MECHANICAL DATA Case: SOT-23, Molded Plastic Terminals: Solderable per MIL-STD-202, Method 208 Polarity: See Diagrams Weight: 0.008 grams (approx.) Marking : Marking Code (See Table On Page 2) PACKAGE INFORMATION Package SOT-23 3K Leader Size 7 inch SOT-23 Top View 1 2 REF. A B C D E F Millimeter Min. Max. 2.80 3.04 2.10 2.55 1.20 1.40 0.89 1.15 1.78 2.04 0.30 0.50 REF. G H J K L Millimeter Min. Max. 0.09 0.18 0.45 0.60 0.08 0.177 0.6 REF. 0.89 1.02 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Parameter Symbol Ratings Maximum Forward Voltage Diode at IF = 100 m A Maximum Power Dissipation @ 25°C 1 Peak Forward Surge Current, 8.3 ms single half sine-wave superimposed on rated load (JEDEC method)...