SMF103FL Overview
Key Features
- Glass passivated device
- Ideal for surface mounted applications
- Low leakage current
- Metallurgically bonded construction
- High temperature soldering: 260°C /10 seconds at terminals MECHANICAL DATA
- Case: JEDEC SOD-123FL, molded plastic over passivated chip
- Terminals: Solder Plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Weight: 0.0008 ounces, 0.022 gram
