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SQ2857F - Chip Type 2C2857 Geometry 0011 Polarity NPN

Key Features

  • ft = 1.2 GHz (typ) at 5 mA/6V Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.3 mils x 2.3 mils 2.3 mils x 2.3 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 3.0 mA IC = 1.0 µA IE = 10 µA VCB = 15 V Min 15 30 2.5 --- Max ------0.01 Unit V dc V dc V dc µA dc hFE IC = 3.0 mA dc, VCE = 1.0.

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Datasheet Details

Part number SQ2857F
Manufacturer Semicoa Semiconductor
File Size 30.06 KB
Description Chip Type 2C2857 Geometry 0011 Polarity NPN
Datasheet download datasheet SQ2857F Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Data Sheet No. 2C2857 Chip Type 2C2857 Geometry 0011 Polarity NPN Generic Packaged Part: 2N2857 Chip type 2C2857 by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: 2N2857, 2N2857UB, SD2857, SD2857F, SQ2857, SQ2857F Product Summary: APPLICATIONS: Designed for use in high-gain, low noise amplifier, oscillator, mixer and UHF converters. Features: ft = 1.2 GHz (typ) at 5 mA/6V Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.3 mils x 2.3 mils 2.3 mils x 2.3 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 3.0 mA IC = 1.