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SQ2904AF - Chip Type 2C2904A Geometry 0600 Polarity PNP

Key Features

  • Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 18 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 10.0 mA, IB = 0 IC = 10 µA, IE = 0 IE = 10 µA, IC = 0 VCB = 50 V, IE = 0 Min 60 60 5.0 --- Max ------10 Unit V dc V dc V dc nA hFE IC = 150 mA dc, VCE = 10 V 4.

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Datasheet Details

Part number SQ2904AF
Manufacturer Semicoa Semiconductor
File Size 29.39 KB
Description Chip Type 2C2904A Geometry 0600 Polarity PNP
Datasheet download datasheet SQ2904AF Datasheet

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Full PDF Text Transcription (Reference)

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Data Sheet No. 2C2904A Chip Type 2C2904A Geometry 0600 Polarity PNP Generic Packaged Parts: 2N2904A Chip type 2C2904A by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: 2N2904A, 2N2904, 2N2906A, 2N2906, 2N2904AUB, SD2904A, SD2904AF, SQ2904A, SQ2904AF, 2N3485, 2N3485A Product Summary: APPLICATIONS: Designed for general purpose switching and amplifier applications. Features: Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 18 kÅ min. Au - 6.5 kÅ nom. 4.0 mils x 4.0 mils 4.0 mils x 4.0 mils 8 mils nominal 20 mils x 20 mils Silox Passivated Electrical Characteristics TA = 25oC Parameter BVCEO BVCBO BVEBO ICBO Test conditions IC = 10.