SQ3960F - Chip Type 2C3960 Geometry 0003 Polarity NPN

Product Overview

Semicoa Semiconductor

Part number	SQ3960F
Manufacturer	Semicoa Semiconductor
File Size	29.98 KB
Description	Chip Type 2C3960 Geometry 0003 Polarity NPN
Datasheet	SQ3960F Datasheet
Additional preview pages of the SQ3960F datasheet.

2N3960, 2N3960UB, SD3960F, SQ3960, SQ3960F Mechanical Specifications Metallization Bonding Pad Size Die Thickness Chip Area Top Surface Top Backside Emitter Base Al - 15 kÅ min. Au - 6.5 kÅ nom. 2.7 mils x 2.7 mils 2.7 mils x 2.7 mils 8 mils nominal 16 mils x 16 mils Silox Passivated Electrical Characteristics Parameter TA = 25oC Test conditions Min Max Unit BVCEO IC = 10.0 mA 12 --V dc BVCBO IC = 10 µA 20 --V dc BVEBO IE = 10.0 mA 4.5 --V dc ICEX VCE = 10 V, VEB = 2.0 V --5.0 nA hFE1 IC = 1.

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Published: May 9, 2005 |