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SK151GB07F3T - IGBT

Key Features

  • Compact design.
  • One screw mounting module.
  • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC).
  • 650V Fast Trench3 IGBT technology.
  • CAL diode technology.
  • Integrated NTC temperature sensor.
  • UL recognized, file no. E 63 532 Typical.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SK 151 GB 07F3 T SEMITOP® 3 IGBT module SK 151 GB 07F3 T Features • Compact design • One screw mounting module • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • 650V Fast Trench3 IGBT technology • CAL diode technology • Integrated NTC temperature sensor • UL recognized, file no.