Datasheet Summary
SEMITOP®E1
IGBT module
Features
-
- Low inductive design
- Press-Fit contact technology
- Rugged mounting due to integrated mounting clamps
- Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC)
- Trench IGBT3 technology
- Robust and soft switching CAL4F diode technology
- Integrated NTC temperature sensor
- UL recognized file no. E 63 532
Typical Applications
- Motor drives
- Servo drives
- Air conditioning
- Auxiliary Inverters
-...