MLSEP24A-0603 Overview
Key Features
- Multilayer structure
- The ESD material hide in the middle of the component
- The planer surface easy to pick up
- Extremely low capacitance
- Very low leakage current
- Fast response time
- Bi-directional
- Surface mount
- Lead free solder termination
- Assistant equipment to pass IEC 61000-4-2
