MLSEP24A-0603 Datasheet | Semitel

Multilayer Polymer ESD Suppressor Features - Multilayer structure - The ESD material hide in the middle of the ponent - The planer surface easy to pick up - Extremely low capacitance - Very low leakage current - Fast response time - Bi-directional - Surface mount - Lead free solder termination - Assistant equipment to pass IEC 61000-4-2 - The best ESD protection for high frequency, low voltage applications MLSEP- - - Series ROHS Application - Cellular phone - Antennas (Cell phone, GPS…) - High speed Ethernet - USB2.0 and IEEE1394 interface - DVI and HDMI interface Electrical Characteristics ESD Capability: IEC 61000-4- 2 direct discharge………………….…8 KV IEC 61000-4- 2 air discharge…………………….…15 KV Trigger voltage………………………………………..300V Clamping voltage……………………………………..40V Rated voltage………………………………………....24V typical Capacitance……………………………………………0.15pf Leakage………………………………………………..﹤5n A Notes: 1. Trigger and clamping voltage measure per IEC 61000-4-2, 8KV direct discharge method 2. Capacitance measured at 1MHZ 3. Leakage current measured at 10VDC Environmental Specifications Operation temperature: -40~90℃ Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85℃,1000hrs Thermal Shock: MIL-STD-202,Method 107G,-65℃to125℃,30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40℃, 3 solutions(H O,detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Polymer ESD Suppressor .semiteltech. Multilayer Polymer ESD Suppressor Product Dimensions...