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SFC05-4 - CSP TVS Flip Chip TVS Diode Array

Datasheet Summary

Description

The SFC05-4 is a quad flip chip CSP TVS diode array.

They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics.

Features

  • u 300 Watts peak pulse power (tp = 8/20µs) u Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small chip scale package requires less board space Low profile (< 0.65mm) No need for underfill material Protects four I/O or data lines Low clamping voltage Working voltage: 5V Solid-state silicon-avalanche technology u u u u u u u Mechanical Characteristics u JEDEC MO-211, Variation BB, 0.50 m.

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Datasheet Details

Part number SFC05-4
Manufacturer Semtech Corporation
File Size 174.75 KB
Description CSP TVS Flip Chip TVS Diode Array
Datasheet download datasheet SFC05-4 Datasheet
Additional preview pages of the SFC05-4 datasheet.

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Full PDF Text Transcription

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CSP TVS Flip Chip TVS Diode Array PROTECTION PRODUCTS Description The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. The SFC series TVS diodes are designed to protect sensitive semiconductor components from damage or latchup due to electrostatic discharge (ESD) and other voltage induced transient events. The SFC05-4 is a 6-bump, 0.5mm pitch flip chip array with a 3x2 bump grid. It measures 1.5 x 1.0 x 0.65mm. This small outline makes the SFC05-4 especially well suited for portable applications. CSP TVS devices are compatible with current pick and place equipment and assembly methods.
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