EClamp2340C
EClamp2340C is Emi Filter And Esd Protection manufactured by SEMTECH.
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EMI Filter and ESD Protection for Color LCD Interface
PRELIMINARY Features
Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4,
+/-15k V (air), +/-8k V (contact)
PROTECTION PRODUCTS
- EMIClamp TM Description
The EClamp TM2340C is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. The device consists of ten identical circuits prised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 100Ω and a capacitance value of 18p F is used to achieve 20d B minimum attenuation from 800MHz to 3GHz. Each line Features two stages of TVS diode protection. The TVS diodes provide effective suppression of ESD voltages in excess of 15k V (air discharge) and 8k V (contact discharge) per IEC 61000-4-2, level 4. The device is a 25-bump, 0.5mm pitch flip chip array with a 5x5 bump grid. It measures 2.6 x 2.6 x 0.65mm. The solder bumps have a nominal diameter of 0.315mm.
Filter performance: 20d B minimum attenuation
800MHz to 3GHz TVS working voltage: 5V Resistor: 100 Ohms Input Capacitance: 18p F (VR = 2.5VDC) Protection and filtering for ten lines Solid-state technology
Mechanical Characteristics
JEDEC MO-211, Variation BF, 0.50 mm pitch flip chip Nominal Dimensions: 2.6 x 2.6 x 0.65 mm Bump Diameter: 315+/-20 µm Non-conductive top side coating Marking : Mark code, lot code, orientation mark Packaging : Tape and Reel per EIA 481
Applications
Color LCD Panel Protection Cell Phone CCD Camera Lines Personal...
