SFC05-4 Datasheet | SEMTECH

Description The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. The SFC series TVS diodes are designed to protect sensitive semiconductor ponents from damage or latchup due to electrostatic discharge (ESD) and other voltage induced transient events. The SFC05-4 is a 6-bump, 0.5mm pitch flip chip array with a 3x2 bump grid. It measures 1.5 x 1.0 x 0.65mm. This small outline makes the SFC05-4 especially well suited for portable applications. CSP TVS devices are patible with current pick and place equipment and assembly methods. Each device will protect up to four data or I/O lines. The CSP design results in lower inductance, virtually eliminating voltage overshoot due to leads and interconnecting bond wires. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15k V air, 8k V contact discharge). PRELIMINARY Features u 300 Watts peak pulse power (tp = 8/20µs) u Transient protection for data lines to IEC 61000-4-2 (ESD) 15k V (air), 8k V (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small chip scale package requires less board space Low profile (< 0.65mm) No need for underfill material Protects four I/O or data lines Low clamping voltage Working voltage: 5V Solid-state silicon-avalanche technology u u u u u u u Mechanical Characteristics u JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip u Marking : Marking Code u Packaging : Tape and Reel Scale Package (CSP) Applications u u u u u u u u Cell Phone Handsets and Accessories Personal Digital Assistants (PDA’s) Notebook & Hand Held puters Portable Instrumentation Pagers Smart Cards MP3 Players GPS Device Dimensions Schematic & PIN Configuration 0.50 TYP 0.65 0.150 A 1 2 3 SFC05-4 Maximum Dimensions (mm) 3 x 2 Grid CSP TVS (Bottom View) .semtech. Revision...