UCLAMP3324P
UCLAMP3324P is Low Voltage TVS manufactured by SEMTECH.
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Low Voltage TVS for ESD Protection
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15k V (air), ±8k V (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Small package for use in portable electronics Protects four I/O Working voltage: 3.3V Flow thru design for easy layout Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology u Clamp3324P
PROTECTION PRODUCTS
- Micro Clamp TM Description
The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 3.3 volts.
The µClamp TM3324P is a solid-state device designed specifically for transient suppression. It is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes. They offer desirable characteristics for board level protection including fast response time, low clamping voltage and no device degradation. The µClamp3324P may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (±15k V air, ±8k V contact discharge). The “flow-thru” design of the device results in enhanced ESD performance due to reduced board trace inductance. The result is lower clamping voltage and a higher level of protection when pared to conventional TVS devices. The µClamp3324P is in an 8-pin, Ro Hs pliant, SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free Ni Pd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and notebook puters.
Mechanical Characteristics
SLP2116P8 package Ro Hs pliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead Finish: Ni...
