FEATURES
1. Ultra-compact type (1.6 x 0.8 x 0.8 mm) 2. Thin type (thickness : 0.8 mm) 3. Taped-packed type (4,000 pieces/reel) 4. Leadless type Ultra-compact Chip Part Type Infrared Emitting Diodes s Outline Dimensions 1.6 (0.2) 0.8 0.3 (Unit : mm) 0.8 1 2 Chip position 1.2 s APPLICATIONS
1. Compact and thin remote controllers 2. Tape end detection of VCRs and VCR cameras 3. Power source for car navigator touch panels 4. Other portable equipment 1.0 0.5 0.3 (0.3) (0.3) * Plating area * Terminal connection 1 Anode 2 Cathode 1 Chip side mark 2 * Tolerance : ± 0.1mm s ABSOLUTE MAXIMUM RATINGS
Parameter Forward current *1 Peak forward current Reverse voltage Power dissipation Operating temperature Storage temperature *2 Soldering temperature *1 Pulse width <= 100µ s, Duty ratio=0.01 *2 Hand soldering temperature, for MAX. 3 seconds (Ta=25˚C) Unit mA mA V mW ˚C ˚C ˚C Symbol Rating IF 50 500 I FM VR 6 150 P - 25 to + 85 Topr - 25 to + 100 Tstg 260 Tsol s Electro-optical Characteristics Param...
Sharp