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LRS1329 - Stacked Chip 16M Flash and 2M SRAM

This page provides the datasheet information for the LRS1329, a member of the LRS Stacked Chip 16M Flash and 2M SRAM family.

Description

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Features

  • OPower ONot supply designed 72 pin or rated CSP as radiation hardened ) plastic package P-type bulk silicon. and SRAM has.
  • . . . 2.7 v -25 to 3.6 V +85 ‘c ~8 bit OOperat ing temperature “c to 0 ( LCSPO72-P-0811 P-type bulk silicon, OFlash Flash memory has Memory Time current (Ihe current Read Word/Byte Block erase (The current Architecture Parameter Blocks/ Boot Location for F-V,, pin) for write F-V, . . . . 100 ns (Max. ) OAccess OOperating pin) . . . - 25 mA (Max. t,U=200ns).

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Datasheet preview – LRS1329

Datasheet Details

Part number LRS1329
Manufacturer Sharp Corporation
File Size 1.29 MB
Description Stacked Chip 16M Flash and 2M SRAM
Datasheet download datasheet LRS1329 Datasheet
Additional preview pages of the LRS1329 datasheet.

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Full PDF Text Transcription

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PRELIMINARY PRODUCT SPECIFICATIONS ® Integrated Circuits Group 16M Flash and 2M SRAM (Model No.: LRS1329) Stacked Chip LRS1329 Spec No.: MFM2-J11601 Issue Date: June 10, 1999 SHARP l LRS1329 Handle this document carefully for it contains material protected by international full or in part,. of this material is prohibited copyright law. Any reproduction, without the express written permission of the company. When using the products covered herein, please observe.the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions. (1) The products covered herein are designed and manufactured for the following application areas.
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