Sharp LT1S90A
DEVICE SPECIFICATION FOR Light Emitting Diode
DESCRIPTION
of inspection and criteria 6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 10. 6-1. Taping 6-2. Packing specification 6-3. Label 6-4. Luminous intensity rank 7. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page’ 11. 7- 1. Reflow soldering 8. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 12. 8-1. Precautions matters for designing circuit 8-2. Cleaning method 9 Env~o~ent.......................................~.............Referto~ea~chedsheetP~e 12. 9-1. Ozonosphere destructive chemicals. 9-2. Bromic non-burning materials 2. Outline dimensi&s and terminal coMections - I( 3. 6 Cathode mark(blackl . Terminal 0 connection Anod: Qc unit mm PWB: Resin: Material Glass-Epoxy Epoxy athode Finish Au Plated Drawing No.