Sharp LT1ZE40A
DEVICE SPECIFICATION FOR . Light Emitting Diode
DESCRIPTION
of inspection and criteria 6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 11. 6-1. Taping 6-2. Label 6-3. Luminous intensity rank 6-4. Dominant wavelength raak 7. Packing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 12. 7- 1. Dampproof package 7-2. Storage conditions 7-3. Treatment after opening 8. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 13. 8- 1. Reflow soldering 8-2. Manual soldering 9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14. 9- 1. Precautions matters for designing circuit 9-2. Cleaning method 10. Ekironment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .