Sharp LT1ZR95A
DEVICE SPECIFICATION FOR Light Emitting Diode
DESCRIPTION
of inspection and criteria 7. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet 7- 1. Taping 7-2. Label 7-3. Dampproof package 8. Soldering . . . . ..*.............................................. Refer to the attached sheet 8- 1. Reflow soldering 8-2. Manual soldering 8-3. Dip soldering method 9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet 9- 1. Precautions matters for designing circuit 9-2. Cleaning method 10. Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet lo- 1. Ozonosphere destructive chemicals. 10-2. Bromic non-burning materials Page 10-13. Page 14. Page 15. Page 15. ------..~~8900 1 1 NodlO/ . 2. Outline dimensions and terminal connections mark p Q) . 7 I 0. . , \\ \ -L-------- -----L--- 0 Anode / @ Cathode / i ote. .