PC81712NSZ0F
Description
PC8171xNSZ0F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in SMT gullwing lead-form option.
Key Features
- 4pin DIP package
- Double transfer mold package (Ideal for Flow Soldering)
- Low input current type (IF=0.5mA)
- High collector-emitter voltage(VCEO : 80V)
- High noise immunity due to high common rejection voltage (CMR : MIN. 10kV/µs)
- High isolation voltage between input and output (Viso(rms) : 5.0 kV)
- Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A03302EN Date Jun. 30. 2005 © SHARP Corporation PC8171xNSZ0F Series
- Internal Connection Diagram
