BSP170P Description
DIN IEC 68-1 VGS Ptot Tj Tstg ±20 1.8 -55 ... footprint @ 6 cm2 cooling area1) RthJS RthJA tbd 70 Symbol min. PCB is vertical without blown air.
- Part: BSP170P
- Manufacturer: Siemens Semiconductor Group
- Size: 152.82 KB
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