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LYR970 Datasheet Chipled

Manufacturer: Siemens Semiconductor Group (now Infineon)

Overview: CHIPLED LY R970, LO R970, LS R970 Besondere Merkmale q q q q q q Gehäusebauform: 0805 Industriestandard bzgl. Lötpadraster geringe Bauteilhöhe für IR-Lötung geeignet für Hinterleuchtungen und als opt.

Key Features

  • q q q q q q 0805 package Industry standard footprint low profile suitable for IR reflow soldering process for use as optical indicator and backlighting available taped on reel (8 mm tape) Typ Emissionsfarbe Color of Emission Type Farbe der Lichtaustrittsfläche Color of the Light Emitting Area colorless clear Lichtstärke Lichtstrom Bestellnummer Luminous Intensity IF = 20 mA I V (mcd) ≥ 4.0 (7 typ. ) ≥ 4.0 (7 typ. ) ≥ 4.0 (7 typ. ) Luminous Flux IF = 20 mA ΦV (mlm) 60 (typ. ) 60 (typ. ) 60 (.

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