SFH6318 Datasheet | Siemens Semiconductor Group

FEATURES - Industry Standard SOIC-8 Surface Mountable Package - High Current Transfer Ratio, 800% - Low Input Current, 0.5m A - High Output Current, 60m A - Isolation Test Voltage, 2500 VACRMS - TTL patible Output, VOL=0.1 V - Adjustable Bandwidth-Access to Base - Underwriters Lab File #E52744 APPLICATIONS - Logic Ground Isolation-TTL/TTL, TTL/CMOS, CMOS/CMOS, CMOS/TTL - EIA RS 232C Line Receiver - Low Input Current Line Receiver-Long Lines, Party Lines - Telephone Ring Detector - 117 VAC Line Voltage Status Indication-Low Input Power Dissipation - Low Power Systems-Ground Isolation DESCRIPTION Very high current ratio together with 2500 VAC isolation are achieved by coupling an LED with an integrated high gain photodetector in a SOIC-8 package. Separate pins for the photodiode and output stage enable TTL patible saturation voltages with high speed operation. Photodarlington operation is achieved by tying the VCC and VO terminals together. Access to the base terminal allows adjustment to the gain bandwidth. The SFH6318 is ideal for TTL applications since the 300% minimum current transfer ratio with an LED current of 1.6 m A enables operation with one unit load-in and one unit load-out with a 2.2 KW pull-up resistor. The SFH6319 is best suited for low power logic applications involving CMOS and low power TTL. A 400% current transfer ratio with only 0.5 m A of LED current is guaranteed from 0°C to 70°C. Caution: Due to the small geometries of this device, it should be handled with Electrostatic Discharge (ESD) precautions. Proper grounding would prevent damage further and/or degradation which may be induced by ESD. .240 (6.10) Pin 1 .015±.002 (.38±.05) 7° .058±.005 (1.49±.13) .125±.005 (3.18±.13) Lead Coplanarity ±.0015 (.04) max. .008 (.20) 5° max. R.010 (.25) max. .021 (.53) .050 (1.27) typ. .020±.004 (.15±.10) 2 plcs. TOLERANCE: ± .005 (unless otherwise noted) Maximum Ratings (25°) Emitter Reverse Input Voltage...