LOR970 Datasheet Chipled

Manufacturer: Siemens Semiconductor Group (now Infineon)

Overview: CHIPLED LY R970, LO R970, LS R970 Besondere Merkmale q Gehäusebauform: 0805 q Industriestandard bzgl. Lötpadraster q geringe Bauteilhöhe q für IR-Lötung geeignet q für Hinterleuchtungen und als opt.

This datasheet includes multiple variants, all published together in a single manufacturer document.

Datasheet Details

Part number	LOR970
Manufacturer	Siemens Semiconductor Group (now Infineon)
File Size	60.28 KB
Description	CHIPLED
Datasheet	LOR970 LOR970-JO Datasheet (PDF)

Key Features

q 0805 package q Industry standard footprint q low profile q suitable for IR reflow soldering process q for use as optical indicator and backlighting q available taped on reel (8 mm tape) VEO06987 Typ Type LY R970-JO LO R970-JO LS R970-JO Emissionsfarbe Color of Emission Farbe der Lichtaustrittsfläche Color of the Light Emitting Area yellow orange super-red colorless clear Lichtstärke Luminous Intensity IF = 20 mA IV (mcd) ≥ 4.0 (7 typ. ) ≥ 4.0 (7 typ. ) ≥ 4.0 (7 typ. ) Lichtstrom Bestellnu.

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Part Number	Description
LOR976	CHIPLED

Datasheet Details

Key Features

More Datasheets from Siemens Semiconductor Group (now Infineon)

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