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BGM240S - Bluetooth SiP Module

Key Features

  • Bluetooth Low Energy 5.3 and Bluetooth Mesh connectivity.
  • Built-in antenna or RF pin.
  • Up to 10 dBm TX output power.
  • -97 dBm BLE 1M RX sensitivity.
  • 32-bit ARM® Cortex®-M33 core running up to 78 MHz.
  • 1536/256 kB of Flash/RAM memory.
  • Vault High or Vault Mid security.
  • Rich set of analog and digital peripherals.
  • 32 GPIO pins.
  • -40 to 105 °C.
  • 7mm x 7mm x 1.18mm Core / Memory ARM CortexTM M33 processor.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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BGM240S Bluetooth™ SiP Module Data Sheet The BGM240S is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices running on Bluetooth networks. Based on the Series 2 EFR32BG24 SoC, it enables Bluetooth® Low Energy connectivity, delivering exceptional RF performance and energy efficiency, industry-leading Secure Vault® technology, and future-proofing capabilities. The BGM240S is a complete System in Package solution offered with robust and fullyupgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market.