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MGM12P32F1024GA-V2 - Mighty Gecko Multi-Protocol Wireless Mesh Module

Download the MGM12P32F1024GA-V2 datasheet PDF. This datasheet also covers the MGM12P variant, as both devices belong to the same mighty gecko multi-protocol wireless mesh module family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • 32-bit ARM® Cortex®-M4 core at 38.4 MHz maximum operating frequency.
  • 1 MB of flash and 256 kB of RAM.
  • ZigBee, Thread, BLE, and multi-protocol support.
  • Pin-compatible with MGM111 module.
  • 12-channel Peripheral Reflex System, Low-Energy Sensor Interface & Multichannel Capacitive Sense Interface.
  • Integrated PA with up to +17 dBm transmit power.
  • Robust peripheral set and up to 25 GPIO Core / Memory ARM CortexTM M4 processor with DSP ex.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MGM12P-SiliconLabs.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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MGM45WU Mobile Board Intel
MGME Motor Panasonic
MGME Motor Panasonic

Other Datasheets by Silicon Labs

Part Number Description
MGM12P32F1024GA-V2R Mighty Gecko Multi-Protocol Wireless Mesh Module
MGM12P32F1024GE-V2 Mighty Gecko Multi-Protocol Wireless Mesh Module
MGM12P32F1024GE-V2R Mighty Gecko Multi-Protocol Wireless Mesh Module
MGM12P Mighty Gecko Multi-Protocol Wireless Mesh Module
MGM12P02F1024GA-V2 Mighty Gecko Multi-Protocol Wireless Mesh Module

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MGM12P Wireless Gecko Multi-Protocol Module Data Sheet The Silicon Labs Wireless Gecko Module (MGM12P) is a fully-integrated, certified module, enabling rapid development of wireless mesh networking solutions. Based on the Silicon Labs EFR32MG12 Wireless Gecko SoC, the MGM12P combines an energy- efficient, multi-protocol wireless SoC with a proven RF/antenna design and industry leading wireless software stacks. This integration accelerates time-to-market and saves months of engineering effort and development costs. In addition, common software and development tools enable seamless migration from a module to discrete SoC-based design when the time is right.