BZX55A5V1 Datasheet | Silicon Supplies

Features : Die Dimensions in µm (mils) - Tight tolerance reverse breakdown voltage - IR characterized at 125°C - Sharp reverse characteristics - Low re verse current Levels - High reliability gold back metal 330 (12.99) 210 (8.27) 210 (8.27) 330 (12.99) Ordering Information The following part suffixes apply: - No suffix - MIL-STD-750 /2073 Visual Inspection - “H” - MIL-STD-750 /2073 Visual Inspection + MIL-PRF-38534 Class H LAT - “K” - MIL-STD-750 /2073 Visual Inspection + MIL-PRF-38534 Class K LAT LAT = Lot Acceptance Test. For further information on LAT process flows see below. .siliconsupplies.qualitybare-die-lot-qualification ANODE CHIP BACKSIDE IS CATHODE Supply Formats: Mechanical Specification 200 (7.87) - Default - Die in Waffle Pack (400 per tray capacity) - Sawn Wafer on Tape - By specific...