ST7539-G4 Overview
Key Features
- PAD ARRANGEMENT ST7539-G4 Bump Height: 10±3um Chip Size: (6160±50)um x (660±50)um Chip Thickness: 300um PAD No. Bump
| Part | ST7539-G4 |
|---|---|
| Description | 192 x 65 Dot Matrix LCD Controller/Driver |
| Manufacturer | Sitronix |
| Size | 627.45 KB |
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