SE2600S
Features
- Integrates an SP3T switch and LNA with bypass mode
- Gain: 12 d B
- Noise Figure: 1.8 d B
- Bluetooth® path loss: 0.5 d B
- Small WLCSP (11-bump, 1.07 x 1.05 x 0.38 mm) 250 μm ball pitch package (MSL1, 260 °C per JEDEC-J-STD-020)
Figure 1. SE2600S Block Diagram
Description
The SE2600S is an integrated Front-End Module (FEM) with a Bluetooth port to plement WLAN chipsets with an integrated Power Amplifier (PA). The SE2600S integrates a Single-Pole, Triple-Throw (SP3T) switch and Low-Noise Amplifier (LNA) with a bypass mode in an ultrapact package. The device is capable of switching between WLAN receive, WLAN transmit, and Bluetooth. The SE2600S is provided in a small, 11-bump, 1.07 x 1.05 mm Wafer Level Chip Scale Package (WLCSP). A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
Figure 2. SE2600S Pinout
- 11-Bump CSP (Top View, Bumps...
