ICX039DNB Datasheet | Sony Semiconductor Solutions

Diagonal 8mm (Type 1/2) CCD Image Sensor for PAL Color Video Cameras Description The ICX039DNB is an interline CCD solid-state image sensor suitable for PAL color video cameras with a diagonal 8mm (Type 1/2) system. Smear, sensitivity, D-range, S/N and other characteristics have been greatly improved pared with the ICX039BNB. High sensitivity and low dark current are achieved through the adoption of Ye, Cy, Mg and G plementary color mosaic filters and HAD (Hole-Accumulation Diode) sensors. This chip Features a field period readout system and an electronic shutter with variable charge-storage time. Also, this outline is miniaturized by using original package. This chip is patible with and can replace the ICX039BNB. 16 pin DIP (Ceramic) Pin 1 2 12 3 Features 40 H Pin 9 - Low smear (- 20d B pared with the ICX039BNB) - High sensitivity (+3.0d B pared with the ICX039BNB) Optical black position - High D range (+2.5d B pared with the ICX039BNB) (Top View) - High S/N - High resolution and low dark current - Excellent antiblooming characteristics - Ye, Cy, Mg, and G plementary color mosaic filters on chip - Continuous variable-speed shutter - Substrate bias: Adjustment free (external adjustment also possible with 6 to 14V) - Reset gate pulse: 5Vp-p adjustment free (drive also possible with 0 to 9V) - Horizontal register: 5V drive - Maximum package dimensions: φ13.2mm Device Structure - Interline CCD image sensor - Image size: Diagonal 8mm (Type 1/2) - Number of effective pixels: 752 (H) x 582 (V) approx. 440K pixels - Total number of pixels: 795 (H) x 596 (V) approx. 470K pixels - Chip size: 7.95mm (H) x 6.45mm (V) - Unit cell size: 8.6µm (H) x 8.3µm (V) - Optical black: Horizontal (H) direction: Front 3 pixels, rear 40 pixels Vertical (V) direction : Front 12 pixels, rear 2 pixels - Number of dummy bits: Horizontal 22 Vertical 1 (even fields only) - Substrate material: Silicon Sony reserves the right to change products and specifications...