Datasheet4U Logo Datasheet4U.com

MCB770 - 2M-Pixel CMOS Camera Module

Key Features

  • further optimization of the pixel layout and on-chip microlenses.
  • IMX011CQ: See CX-NEWS Vol. 40. V O I C E This newly-developed camera module was made possible by the persistence of each of the persons in charge of the various components; the lens, sensor, DSP, mechanism, mounting, image quality, and plant. Our idea was to provide more freedom and more fun to users, we wanted our users to experience the pleasure of being able to photograph the things around them freely and easily. We.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
MCB05 Mid Current Chip Beads Allied Components International
MCB0603B121FBP Chip Ferrite Bead INPAQ
MCB0603B241FBP Chip Ferrite Bead INPAQ
MCB0603B301CBP Chip Ferrite Bead INPAQ
MCB0603B800FBP Chip Ferrite Bead INPAQ

Other Datasheets by Sony Semiconductor Solutions

Part Number Description

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com 2M-Pixel CMOS Camera Module with Autofocus Function for Mobile Equipment MCB770 Based on Sony’s experience introducing 1.3M-pixel CCD camera modules to the marketplace, Sony has embarked on efforts to respond to customer desires for increased pixel counts, improved functionality, reduced power consumption, and further miniaturization and lower mounting heights in CCD camera modules. The MCB770 introduced here is a new product that responds to these desires with newly-developed technologies such as a 2M-pixel CMOS sensor and an AF function that can handle a wide range of camera to subject distances.