DESCRIPTION
PIN CONFIGURATION FEATURE -30V/-10A, RDS(ON) = 50mΩ @VGS = -10V -30V/-5A, RDS(ON) = 80mΩ @VGS = -4.5V Super high density cell design for extremely low RDS(ON) Exceptional on-resistance and maximum DC current capability TO-220 package design ABSOULTE MAXIMUM RATINGS
(Ta = 25℃ Unless otherwise noted ) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ=150℃) Pulsed Drain Current Symb ol VDSS TA=25℃ TA=100℃ VGSS ID IDM Typical -30 ±20 -15.0 -8.0 -60 Power Dissipation TA=25℃ PD 62.5 Operation Junction Temperature Storgae Temperature Range TJ TSTG -55/150 -55/150 Thermal Resistance-Junction to Ambient RθJA 62 Unit V V A A W ℃ ℃ ℃/W STANSON TECHNOLOGY 120 Bentley Square, Mountain View, Ca 94040 USA Copyright © 2009, Stanson Corp. ST9435GP 2010. V1 ST9435GP P Channel Enhancement Mode MOSFET -15.0A ELECTRICAL CHARACTERISTICS
( Ta = 25℃ Unless otherwise noted ) Parameter Symbol Condition Min Typ Max Unit Static Drain-Source Breakdown Voltage Gate Threshol...