! Ideally suited for load dump protection ! Plastic package has Underwriters Laboratory
Flammability Classification 94V-0 ! High temperature stability due to unique oxide passiva-
tion and patented PAR®construction ! Integrally molded heatsink provides a very low thermal
resistance for maximum heat dissipation ! Low leakage current at T J = 175°C ! High temperature soldering guaranteed:
260°C for 10 seconds at terminals ! Low forward voltage drop
Mechanical Data
! Case: DO-218AB integrally mount.
SM8S30 Datasheet
