SS55C Overview
Key Specifications
Key Features
- Schottky Barrier Chip !
- Ideally Suited for Automatic Assembly !
- Low Power Loss, High Efficiency !
- For Use in Low Voltage Application !
- Guard Ring Die Construction B SMC/DO-214AB !
- Case: SMC/DO-214AB, Molded Plastic !
- Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026 !
- Polarity: Cathode Band or Cathode Notch !
- Marking: Type Number !
- Weight: 0.21 grams (approx.) J H G E C 2.75 3.18 D 0.15 0.31 D E 7.75 8.13 G 0.10 0.20 H 0.76 1.52 J 2.00 2.62 All Dimensions in mm
