LBWA18HEPZ Datasheet | Sychip

.. WLAN Product Brief LBWA18HEPZ WLAN 802.11b/g module Features and Benefits - - - - - Thin package:1.3mm typ, 1.4mm max. Small footprint:8.2mm x 8.4mm Multiple power-save modes to maximize battery life Advanced Security Bluetooth active signaling interface for optimum packet efficiency Qo S Packet prioritization for time sensitive payload OS Support for Windows Mobile, Linux WLAN SDIO / SPI Host Interfaces The LBWA18HEPZ is an IEEE 802.11b/g wireless LAN module requiring just 64 square millimeters of host PCB area. Integrated within the module are a host of active and passive ponents resulting in a single simple package for the customer. On module ponents include the WLAN chip, EEPROM, LDO regulator, driver and power amplifier, crystal, balun, and SPDT switch, The feature set for WLAN includes IEEE 802.11i security, Quality of Service (Qo S) traffic prioritization for Vo IP and multimedia applications, an ultra low power sleep mode. An internal Bluetooth signaling interface along with AFH is utilized for enhanced coexistence for the two radios who share the same 2.4 GHz spectrum. This module is targeted to consumer electronics where high integration, proven coexistence, and fast design cycles are highly valued. The module integrates the latest silicon technology for mobile client Wireless LAN offering the best feature set while minimizing space and power consumption. This module utilizes a QFN package and allows direct attachment to the main Printed Circuit board utilizing industry standard surface mount technology processing for high volume production. - - - Verion Corporate Headquarters Parkway Centre II 2805 North Dallas Parkway, Suite 400 Plano, TX 75093 U. S. A. Tel: (1) 972-202-8888 - Fax: (1) 972-633-0327 Veron0.1 .. LBWA18HEPZ Block Diagram Specifications: - - - - - - - - - - - - Standards Conformance: 802.11b/g WLAN Frequency Range: 2.4 to 2.5 GHz Operational Voltage range: 3.3Vdc WLAN Host Interface: 1.8...