LBWA18HEPZ - Wlan 802.11b/g Module

Datasheet Summary

Features

Thin package:1.3mm typ, 1.4mm max. Small footprint:8.2mm x 8.4mm Multiple power-save modes to maximize battery life Advanced Security Bluetooth active signaling interface for optimum packet efficiency QoS Packet prioritization for time sensitive payload OS Support for Windows Mobile, Linux WLAN SDIO / SPI Host Interfaces The LBWA18HEPZ is an IEEE 802.11b/g wireless LAN module requiring just 64 square millimeters of host PCB area. Integrated with.

LBWA18HEPZ Wlan 802.11b/g Module by Sychip - Datasheet Preview — Datasheet preview – LBWA18HEPZ

Datasheet Details

Part number	LBWA18HEPZ
Manufacturer	Sychip
File Size	146.78 KB
Description	Wlan 802.11b/g Module
Datasheet	LBWA18HEPZ Datasheet
Additional preview pages of the LBWA18HEPZ datasheet.

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www.datasheet4u.com WLAN Product Brief LBWA18HEPZ WLAN 802.11b/g module Features and Benefits • • • • • Thin package:1.3mm typ, 1.4mm max. Small footprint:8.2mm x 8.4mm Multiple power-save modes to maximize battery life Advanced Security Bluetooth active signaling interface for optimum packet efficiency QoS Packet prioritization for time sensitive payload OS Support for Windows Mobile, Linux WLAN SDIO / SPI Host Interfaces The LBWA18HEPZ is an IEEE 802.11b/g wireless LAN module requiring just 64 square millimeters of host PCB area. Integrated within the module are a host of active and passive components resulting in a single simple package for the customer.

Published: Apr 30, 2009 |