TZM5229B - (TZM5221B - TZM5267B) 500mW Surface Mount Zener Diodes
TAITRON Components Incorporated
General Description
Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.1 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions
PD VF RthJA TJ TSTG
IF=200mA
Note: Valid provided that leads at a distance of 10mm from case are ke
Key Features
Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-202E, Method 208 Color band denotes cathode end Approx. 0.03 grams
Maximum Rati.
Full PDF Text Transcription for TZM5229B (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
TZM5229B. For precise diagrams, and layout, please refer to the original PDF.
www.DataSheet4U.com 500mW Surface Mount Zener Diodes TZM5221B - TZM5267B 500mW Surface Mount Zener Diodes Features • • • • • • • • Planar Die Construction 500mW Power Dis...
View more extracted text
iodes Features • • • • • • • • Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant MiniMelf Mechanical Data Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-202E, Method 208 Color band denotes cathode end Approx. 0.03 grams Maximum Ratings & Electrical Characteristics (T Ambient=25ºC unless noted otherwise) Symbol Description Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junct
TZM5229B Datasheet
